Event announcement date · GlobalFoundries
GlobalFoundries qualifies SLATE wafer bonding on the 9SW RF-SOI platform
GlobalFoundries announced production readiness of SLATE wafer-to-wafer bonding on its 9SW RF-SOI platform in Singapore, with volume production expected to ramp in the second half of 2027.
Why it matters
Production readiness gives customers a qualified path to design more compact vertically integrated RF front ends, while GF still described volume production as a future ramp expected in the second half of 2027 rather than current high-volume output.
Original announcement / source · GlobalFoundries ↗