Event announcement date · Samsung
Samsung and Broadcom expand strategic collaboration across memory, foundry and packaging
Samsung and Broadcom signed an MoU covering more than $200 billion of estimated collaboration through 2030 across HBM and other memory supply, leading-edge foundry and advanced packaging.
Why it matters
The MOU broadens the companies' relationship across several semiconductor layers that normally require separate supply and manufacturing arrangements, but the more-than-$200-billion figure is an estimated collaboration value through 2030 rather than disclosed booked revenue, purchase orders or completed shipments.
Original announcement / source · Samsung Electronics ↗