Event announcement date · SK hynix
SK hynix breaks ground on its first U.S. AI-memory production hub
SK hynix held the groundbreaking for a more than $4 billion advanced HBM packaging facility in West Lafayette, Indiana, with next-generation HBM mass production planned for the second half of 2029.
Why it matters
The project creates a U.S. HBM advanced-packaging production base and links it to Purdue R&D and a local supplier ecosystem.
Original announcement / source · SK hynix ↗